Report overview
Fan-Out Packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional fan-out packages use an epoxy mold compound to fully embed the dies, rather than placing them upon a substrate or interposer. Fan-Out packaging typically involves dicing chips on a silicon wafer, and then very precisely positioning the known-good chips on a thin ?reconstituted? or carrier wafer/panel, which is then molded and followed by a redistribution layer (RDL) atop the molded area (chip and fan-out area), and then forming solder balls on top.
This report contains market size and forecasts of Fan-Out Packaging in Global, including the following market information:
Global Fan-Out Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Fan-Out Packaging market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Core Fan-Out Packaging Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Fan-Out Packaging include ASE Group, YoleDeveloppement, Atotech, NXP, Camtek, STATS ChipPAC, Deca Technologies, INTEVAC and Onto Innovation, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Fan-Out Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fan-Out Packaging Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Fan-Out Packaging Market Segment Percentages, by Type, 2021 (%)
Core Fan-Out Packaging
High-Density Fan-Out Packaging
Global Fan-Out Packaging Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Fan-Out Packaging Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Automobile Industry
Aerospace and Defense
Telecom Industry
Other
Global Fan-Out Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Fan-Out Packaging Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Fan-Out Packaging revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Fan-Out Packaging revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE Group
YoleDeveloppement
Atotech
NXP
Camtek
STATS ChipPAC
Deca Technologies
INTEVAC
Onto Innovation
Amkor Technology Inc.
Samsung Electro-Mechanics
Powertech Technology Inc.
