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3D Molded Interconnect Device (MID) Market, Global Outlook and Forecast 2023-2030

3D Molded Interconnect Device (MID) Market, Global Outlook and Forecast 2023-2030

  • Published on : 25 January 2023
  • Pages :77
  • Report Code:SMR-7543111

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Report overview

Three-Dimensional?Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection?Molded?Circuit Carriers.
This report contains market size and forecasts of 3D Molded Interconnect Device (MID) in global, including the following market information:
Global 3D Molded Interconnect Device (MID) Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global 3D Molded Interconnect Device (MID) Market Sales, 2018-2023, 2023-2030, (Units)
Global top five 3D Molded Interconnect Device (MID) companies in 2022 (%)
The global 3D Molded Interconnect Device (MID) market was valued at US$ million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
Antennae and Connectivity Modules Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of 3D Molded Interconnect Device (MID) include Molex, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, Taoglas, Harting, Arlington Plating Company, MID Solutions and 2E Mechatronic, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the 3D Molded Interconnect Device (MID) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 3D Molded Interconnect Device (MID) Market, by Type, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global 3D Molded Interconnect Device (MID) Market Segment Percentages, by Type, 2022 (%)
Antennae and Connectivity Modules
Sensors
Connectors and Switches
Lighting Systems
Others
Global 3D Molded Interconnect Device (MID) Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global 3D Molded Interconnect Device (MID) Market Segment Percentages, by Application, 2022 (%)
Telecommunications
Consumer Electronics
Automotive
Medical
Military & Aerospace
Others
Global 3D Molded Interconnect Device (MID) Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (Units)
Global 3D Molded Interconnect Device (MID) Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies 3D Molded Interconnect Device (MID) revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies 3D Molded Interconnect Device (MID) revenues share in global market, 2022 (%)
Key companies 3D Molded Interconnect Device (MID) sales in global market, 2018-2023 (Estimated), (Units)
Key companies 3D Molded Interconnect Device (MID) sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Molex
TE Connectivity
Amphenol Corporation
LPKF Laser & Electronics
Taoglas
Harting
Arlington Plating Company
MID Solutions
2E Mechatronic
KYOCERA AVX
Johnan