Report overview
Package substrate transmits electric signals between semiconductors and the main board, and it is mainly used for the core semiconductors of mobile devices and PCs.
This report aims to provide a comprehensive presentation of the global market for Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Package Substrates. This report contains market size and forecasts of Package Substrates in global, including the following market information:
Global Package Substrates Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Package Substrates Market Sales, 2018-2023, 2024-2029, (K sqm)
Global top five Package Substrates companies in 2022 (%)
The global Package Substrates market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
FCCSP Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Package Substrates include Ibiden, Shinko Electric Industries, Kyocera, Samsung Electro-Mechanics, Fujitsu, Hitachi, Eastern, LG Innotek and Simmtech, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Package Substrates manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Package Substrates Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K sqm)
Global Package Substrates Market Segment Percentages, by Type, 2022 (%)
FCCSP
WBCSP
SiP
BOC
FCBGA
Global Package Substrates Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K sqm)
Global Package Substrates Market Segment Percentages, by Application, 2022 (%)
Mobile Devices
Automotive Industry
Others
Global Package Substrates Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K sqm)
Global Package Substrates Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Package Substrates revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Package Substrates revenues share in global market, 2022 (%)
Key companies Package Substrates sales in global market, 2018-2023 (Estimated), (K sqm)
Key companies Package Substrates sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Ibiden
Shinko Electric Industries
Kyocera
Samsung Electro-Mechanics
Fujitsu
Hitachi
Eastern
LG Innotek
Simmtech
Daeduck
AT&S
Unimicron
Kinsus
Nan Ya PCB
ASE Group
TTM Technologies
Zhen Ding Technology
Shenzhen Fastprint Circuit Tech
Outline of Major Chapters:
Chapter 1: Introduces the definition of Package Substrates, market overview.
Chapter 2: Global Package Substrates market size in revenue and volume.
Chapter 3: Detailed analysis of Package Substrates manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Package Substrates capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
